Model Based Control…Out of the Box

Meet one-on-one with a DDI engineer for a demonstration of DDI’s game changing Fusion.MBC, an integrated model based temperature control solution with built-in functional safety.  Designed for on-wafer semiconductor applications, Fusion.MBC delivers pin-point control of wafer temperature up to 64-zones in a compact package.  Fusion.MBC support all thermocouple types, as well as 2, 3 and 4-wire RTD’s.

As part of DDI’s Fusion.IO platform, Fusion.MBC is certified by TUV as a SIL rated system interlock controller.  When when installed and configured with redundant temperature sensing inputs, Fusion.MBC enables tool level safety up to SIL3.

In 20 minutes, we’ll talk through your application, answer technical questions and show you how Fusion.MBC could fit into your next tool design.

Schedule a 20-Minute Technical Demo

SEMICON WEST 2026
October 13–15, 2026
Moscone Center | San Francisco
Booth # 465

Choose a preferred day and time:

Tuesday, October 13
Wednesday, October 14
Thursday, October 15

Bring More Control Functions Into One Platform

Fusion.IO gives engineers the ultimate in modularity & flexibility, speeding development time & release to market.

  • Broad range of I/O types, including digital, analog & temperature
  • Built-in Functional Safety, up to SIL3
  • Safety rated programmable interlocks
  • Model-based Temperature control
  • Real-time EtherCAT communications
  • Intuitive graphical interlock design

Combine the functions your application requires without automatically adding a standalone control product for each one.

Fewer components. Fewer connections. Less to integrate.

 

 

 

 

Bring Us Your Control Challenge

Designing a new tool or reworking an existing one? Bring us the control requirements you’re trying to solve.

Use the 20 minutes to answer questions like:

Can Fusion.IO handle our I/O count and signal requirements?
How would it handle our safety and interlock requirements?
Which existing control components could potentially be consolidated?
How would it integrate with our current architecture?
What would implementation require?

You’ll leave knowing which control functions Fusion.IO could handle, where components could be consolidated and how the platform could integrate with your architecture.

Frequently Asked Questions

1. Can Fusion.IO be configured for our specific equipment?

Yes. Fusion.IO is modular, so I/O and control functions can be selected around your application. DDI can also customize field connections, signal mapping, connectors and packaging to fit specific equipment requirements.

2. Can Fusion.IO work with our existing control architecture?

Yes. Fusion.IO can be configured around the I/O and control functions your equipment requires. DDI can review your current architecture and help determine where Fusion.IO may fit.

3. How does Fusion.IO communicate with the equipment controller?

Fusion.IO uses EtherCAT for real-time communication with the host controller, allowing I/O, safety, temperature control and other functions to operate within the equipment’s control architecture.

4. What should I bring to the demo?

To get the most out of your demo, bring an I/O list, block diagram, requirements or current architecture if you have them. This gives DDI’s engineers a better understanding of your equipment so they can focus the demo on the control requirements and challenges that matter to your application.